Keyphrases
Solder Joint
100%
Soldering
57%
Lead-free Solder Joints
27%
Intermetallic Compounds
26%
Crystalline Silicon Photovoltaic Modules
25%
Fatigue Life
24%
Printed Circuit Board
24%
Ball Grid Array
23%
Thermomechanical Reliability
19%
Flip-chip Assembly
19%
High Temperature
18%
Photovoltaic Module
17%
Electronic Components
16%
Strain Energy Density
15%
Thermal Interface Materials
15%
Surface Mounting
15%
SAC405
15%
Interconnection Technology
14%
Thermal Cycling
13%
Solder Interconnect
13%
Thermal Performance
13%
Crystalline Silicon Solar Cell
12%
Ball Grid Array Solder Joint
12%
SAC387
12%
Lead-free
11%
High-temperature Reliability
11%
Reflow Profile
11%
Solar Cell Fabrication
11%
Flip chip
11%
SAC305
11%
Solder Bump
11%
Sn63Pb37
10%
Lead-based
10%
Creep Strain
10%
Automotive Electronic Control Units
10%
Creep-fatigue
10%
Tropical Climate
10%
Standoff
10%
Temperature Cycle
9%
Electronic Control Unit
9%
Isothermal Aging
9%
Coefficient of Thermal Expansion
9%
Stress-strain
9%
Elevated Temperature
9%
Strain Energy
9%
Lead-free Solder
8%
Operating Temperature
8%
Arrhenius
8%
Thermomechanical Degradation
8%
Electronic Packaging
8%
Engineering
Joints (Structural Components)
99%
Ball Grid Arrays
34%
Creep
29%
Free Solder
28%
Printed Circuit Board
26%
Fatigue Life
25%
Photovoltaic Modules
25%
Interconnects
23%
Structural Reliability
16%
Silicon Solar Cell
14%
Crystalline Silicon
14%
Eutectics
13%
Material Interface
13%
Intermetallics
12%
Control Unit
12%
Electronic Control
12%
Isothermal
10%
Microelectronics
10%
Strain Energy Density
10%
Random Vibration
10%
Geopolymer
10%
Fatigue Behavior
10%
Profile Parameter
10%
Heat Resistance
8%
Solder Bump
8%
Thermal Performance
8%
Thermal Impact
7%
Power Device
7%
Peak Temperature
7%
Coefficient of Thermal Expansion
7%
Numerical Study
7%
Elevated Temperature
7%
Shear Strength
6%
Mechanical Degradation
6%
Arrhenius
6%
Thermal Effect
6%
Test Vehicle
6%
Strain Energy
6%
Led Chip
6%
Ordinary Portland Cement
5%
Degradation Rate
5%
Health Issue
5%
Automotive Electronics
5%
Civil Engineering
5%
Construction Sector
5%
Thermoelectricity
5%
Insulated Gate Bipolar Transistor
5%
Mechanical Loading
5%
Processing Technology
5%
Alloy Composition
5%
Material Science
Solder Joint
95%
Creep
41%
Fatigue of Materials
25%
Lead-Free Solder
22%
Electronic Circuit
21%
Thermal Cycling
21%
Photovoltaic Modules
20%
Interface (Material)
16%
Energy Density
16%
Random Vibration
15%
Silicon Solar Cell
14%
Electronic Component
13%
Density
12%
Intermetallics
11%
Fatigue Behavior
10%
Thermal Expansion
10%
Thermal Fatigue
10%
Finite Element Method
9%
Phase Composition
8%
Metallic Compound
7%
Silver
7%
Solar Cell
6%
Mechanical Degradation
6%
Heat Resistance
6%
Shear Strength
5%
Finite Element Modeling
5%
Materials Property
5%
Crystalline Silicon Solar Cell
5%
Thermal Degradation
5%
Bipolar Transistor
5%
Geopolymer
5%
Polylactide
5%
Mechanical Property
5%
Phase Change Material
5%
Feedstock
5%
Mechanical Deformation
5%
Aluminum Foil
5%
Compression Load
5%
