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2019

3D printing of intricate sand cores for complex copper castings

Hughes, D., Sutherland, L. & Amalu, E., 2019.

Research output: Contribution to conferenceAbstract

Foundry sand
Printing
Binders
Copper
Sand
33 Downloads (Pure)

Effect of Relative Density on Compressive Load Response of Crumpled Aluminium Foil Mesh

Hughes, D., Amalu, E., Pak, T. & Kennedy, R., 3 Dec 2019, In : Materials. 12, 23, 17 p., 4018.

Research output: Contribution to journalArticle

Open Access
File
Aluminum foil
Metals
Compaction
Aluminum sheet
Structural design
2018
104 Downloads (Pure)

Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates

Ogbomo, O. O., Amalu, E. H., Ekere, N. N. & Olagbegi, P. O., 31 Aug 2018, In : Solar Energy. 170, p. 682-693 12 p.

Research output: Contribution to journalArticle

Open Access
File
Silicon
Soldering alloys
Crystalline materials
Degradation
Temperature

Effect Of Temperature On Conductivity Of PLA-Carbon 3D Printed Components

Hughes, D. & Amalu, E., 2018.

Research output: Contribution to conferencePaper

Open Access
Carbon
Acids
Thermoplastics
Electric properties
Temperature
103 Downloads (Pure)
Open Access
File
Silicon
Degradation
Crystalline materials
Temperature
Weathering
2017
205 Downloads (Pure)

A review of photovoltaic module technologies for increased performance in tropical climate

Ogbomo, O., Amalu, E., Ekere, N. N. & Olagbegi, P. O., Aug 2017, In : Renewable and Sustainable Energy Reviews. 75, p. 1225-1238

Research output: Contribution to journalArticle

Open Access
File
Cadmium telluride
Conversion efficiency
Crystalline materials
Tropics
Atmospheric humidity
211 Downloads (Pure)
Open Access
File
Soldering alloys
Thermal expansion
Silver
Creep
Zinc
5 Citations (Scopus)

Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections

Zarmai, M. T., Ekere, N. N., Oduoza, C. F. & Amalu, E. H., 31 Oct 2017, In : Robotics and Computer-Integrated Manufacturing. 47, p. 37-43 7 p.

Research output: Contribution to journalArticle

Solder Joint
Fatigue Life
Creep
Solar Cells
Interconnection
130 Downloads (Pure)
Open Access
File
Silicon
Crystalline materials
Degradation
Soldering alloys
Laminates
2016
Open Access
Soldering alloys
Creep
Hysteresis loops
Resistors
Strain energy

Operation of Solar Energy Systems in Hot Climate.

Ogbomo, O., Amalu, E. & Ekere, N. N., 2016.

Research output: Contribution to conferencePaper

Robust solar panel for improved performance in elevated temperature climate.

Ogbomo, O., Amalu, E. & Ekere, N. N., 2016.

Research output: Contribution to conferencePaper

2015

A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly

Zarmai, M. T., Ekere, N. N., Oduoza, C. F. & Amalu, E., 15 May 2015, In : Applied Energy. p. -

Research output: Contribution to journalArticle

Open Access
Silicon solar cells
silicon
Crystalline materials
Soldering
Tropics

Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E. & Ekere, N. N., 2015.

Research output: Contribution to conferencePaper

Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly

Zarmai, M. T., Ekere, N. N., Oduoza, C. F. & Amalu, E., 2015.

Research output: Contribution to conferencePaper

Soldering alloys
Intermetallics
Solar cells
Silicon solar cells
Degradation

Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E. & Ogunsemi, B., 2015.

Research output: Contribution to conferencePaper

Evaluation of Garofalo Creep Model for Lead-free Solder Joints in Surface Mount Components

Amalu, E., Ekere, N. N., Oduoza, C. F. & Zarmai, M. T., 2015.

Research output: Contribution to conferencePaper

Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method

Amalu, E., Ekere, N. N., Zarmai, M. T. & Takyi, G., 2015, In : Finite Elements in Analysis and Design. p. -

Research output: Contribution to journalArticle

Open Access
Solder Joint
Taguchi Method
Taguchi methods
Design of Experiments
Resistors

Optimisation of thermo-mechanical reliability of solder joints in surface mount resistor.

Amalu, E., Ekere, N. N., Oduoza, C. F. & Zarmai, M. T., 2015.

Research output: Contribution to conferencePaper

Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly

Zarmai, M. T., Ekere, N. N., Oduoza, C. F. & Amalu, E., 28 Dec 2015, In : Microelectronics Reliability. p. -

Research output: Contribution to journalArticle

Open Access
Silicon solar cells
solders
Soldering alloys
assembly
solar cells

Thermo-mechanical reliability of lead- free solder joints in solar cell assembly.

Zarmai, M. T., Ekere, N. N., Oduoza, C. F. & Amalu, E., 2015.

Research output: Contribution to conferencePaper

Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

Amalu, E., Ekere, N. N. & Zarmai, M. T., 2014.

Research output: Contribution to conferencePaper

2012

Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Amalu, E. H. & Ekere, N. N., Dec 2012, In : Computational Materials Science. 65, p. 470-484

Research output: Contribution to journalArticle

Flip chip
Solder Joint
Cycling
Thermal cycling
Intermetallics

High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

Amalu, E. H. & Ekere, N. N., Dec 2012, In : Microelectronics Reliability. 52, 12, p. 2982-2994

Research output: Contribution to journalArticle

thermal fatigue
fatigue life
solders
Soldering alloys
chips

High temperature reliability of lead-free solder joints in a flip chip assembly

Amalu, E. H. & Ekere, N. N., 1 Feb 2012, In : Journal of Materials Processing Technology. 212, 2, p. 471-483

Research output: Contribution to journalArticle

Soldering alloys
Intermetallics
Temperature
Printed circuit boards
Lead-free solders
24 Citations (Scopus)

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Bhatti, R. S., Ekere, N. N., Mallik, S. & Amalu, E. H., 1 Jul 2012, In : Microelectronics Reliability. 52, 7, p. 1409-1419 11 p.

Research output: Contribution to journalArticle

voids
chips
Soldering alloys
Heat resistance
solders

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations

Amalu, E. H. & Ekere, N. N., Nov 2012, In : Microelectronics Reliability. 52, 11, p. 2731-2743

Research output: Contribution to journalArticle

fatigue life
solders
Soldering alloys
assembly
chips

Thermal management materials for electronic control unit: Trends, processing technology and R&D challenges

Otiaba, K. C., Ekere, N. N., Amalu, E. H., Bhatti, R. S. & Mallik, S., 1 Jan 2012, Advances in Materials and Systems Technologies III. p. 301-307 7 p. (Advanced Materials Research; vol. 367).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature control
Processing
Materials properties
Heat losses
Temperature
2011

Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module

Takyi, G. & Amalu, E., 11 May 2011, In : Soldering and Surface Mount Technology. 23, 2, p. 115-119 5 p.

Research output: Contribution to journalArticle

solders
coolers
Soldering alloys
integrity
modules

Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Amalu, E. H., Ekere, N. N. & Aminu, G., 1 Dec 2011, 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings. p. 208-213 6 p. 6145173

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallic compounds
Soldering alloys
Temperature
Plastics
Structural integrity

Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application

Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S. & Amalu, E. H., 1 Dec 2011, EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. 6142405

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Automobile electronic equipment
Nanotechnology
Carbon nanotubes
Carbon nanofibers
Chemical vapor deposition
4 Citations (Scopus)

Investigation of effects of heat sinks on thermal performance of microelectronic package

Ekere, N. & Amalu, E., 1 Dec 2011, 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings. p. 127-132 6 p. 6145164

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heat sinks
Microelectronics
Aluminum
Copper
Hot Temperature

Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter

Amalu, E. H., Ekere, N. N. & Aminu, G., 2011.

Research output: Contribution to conferencePaper

6 Citations (Scopus)

Thermal effects of die-attach voids location and style on performance of chip level package

Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S. & Amalu, E. H., 1 Dec 2011, 3rd IEEE International Conference on Adaptive Science and Technology, ICAST 2011, Proceedings. p. 231-236 6 p. 6145176

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal effects
Soldering alloys
Heat resistance
Packaging
Spreaders
50 Citations (Scopus)

Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S. & Amalu, E. H., 1 Dec 2011, In : Microelectronics Reliability. 51, 12, p. 2031-2043 13 p.

Research output: Contribution to journalReview article

Automobile electronic equipment
electronic control
trends
carbon nanotubes
Carbon Nanotubes