A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

E.H. Amalu, W.K. Lau, N.N. Ekere, R.S. Bhatti, S. Mallik, K.C. Otiaba, G. Takyi

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds