Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)

In the rapidly evolving landscape of electronic devices, the reliability of ball grid array (BGA) solder joints is paramount, particularly under the strenuous conditions imposed by miniaturisation and enhanced functionality. This study utilizes Finite Element Analysis (FEA) to examine the vulnerability of BGA solder interconnects to failures caused by creep and random vibrations, with a focus on mainstream lead-free Sn-Ag-Cu (SAC) solders and traditional lead-based eutectic solder (Sn63Pb37). Our analysis sheds light on the stress and strain distribution patterns that presage material degradation by simulating the complex interplay of thermal and mechanical stresses. Key findings underscore the superior resilience of SAC405 under thermal cycling, with SAC396 exhibiting commendable performance in mitigating inelastic deformation under vibrational stress. These insights not only advance our understanding of solder joint behaviour but also guide alloy selection towards enhancing the durability and reliability of electronic assemblies. The outcomes of this study serve as a cornerstone for developing more robust electronic systems, ensuring their reliability in mission-critical applications across diverse sectors.