Keyphrases
Soldering
100%
Solder Material
100%
Ball Grid Array
100%
Random Vibration Response
100%
SAC405
66%
Solder Joint
50%
Sn63Pb37
50%
Printed Circuit Board
33%
Safety-critical Applications
33%
Fatigue Life
16%
ANSYS Finite Element
16%
Weakest Link
16%
SolidWorks Software
16%
Further Analysis
16%
Solder Interconnect
16%
Ball Grid Array Solder Joint
16%
Copper Pad
16%
Electronic System
16%
Low Stress
16%
Electronic Packaging
16%
Electronics Reliability
16%
SAC387
16%
Strain Concentration
16%
SAC305
16%
Sn-Ag-Cu
16%
Electronic Module
16%
Finite Element Analysis Software
16%
High Strain
16%
High Elastic Modulus
16%
Application Reliability
16%
Mass Density
16%
Joint Deformation
16%
Elastic Strain
16%
Strain Magnitude
16%
Computer-aided Engineering
16%
Engineering
Joints (Structural Components)
100%
Interconnects
100%
Ball Grid Arrays
100%
Random Vibration
100%
Printed Circuit Board
50%
Critical Application
50%
Eutectics
50%
Phase Composition
50%
Fatigue Life
25%
Solidworks
25%
Elastic Strain
25%
Electronic Module
25%
Electronic Packaging
25%
Computer Aided Engineering
25%
Computer Aided Design
25%
Finite Element Analysis
25%
Modulus of Elasticity
25%
Material Science
Solder Joint
100%
Random Vibration
100%
Electronic Circuit
50%
Phase Composition
50%
Density
25%
Fatigue of Materials
25%
Finite Element Method
25%
Elastic Moduli
25%