Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

JOSHUA A. DEPIVER, SABUJ MALLIK, Yiling Lu, Emeka Amalu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abstract

Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly's heart lies the 'soldering technology' and the 'solder joints' between electronic components and
substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40℃ to 150℃, and isothermal ageing was done at −40, 25, 75 and 150℃ temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders' strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.
Original languageEnglish
Title of host publicationAdvances in Manufacturing Technology XXXIV
EditorsMahmoud Shafik, Keith Case
PublisherIOS Press
Pages187-197
Number of pages11
Volume15
ISBN (Electronic)9781643681993
ISBN (Print)9781643681986
DOIs
Publication statusPublished - 10 Sep 2021
Event18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research - Derby, United Kingdom
Duration: 7 Sep 202110 Sep 2021

Conference

Conference18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research
Abbreviated titleICMR2021
Country/TerritoryUnited Kingdom
CityDerby
Period7/09/2110/09/21

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