Abstract
Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly's heart lies the 'soldering technology' and the 'solder joints' between electronic components and
substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40℃ to 150℃, and isothermal ageing was done at −40, 25, 75 and 150℃ temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders' strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.
substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40℃ to 150℃, and isothermal ageing was done at −40, 25, 75 and 150℃ temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders' strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.
| Original language | English |
|---|---|
| Title of host publication | Advances in Manufacturing Technology XXXIV |
| Editors | Mahmoud Shafik, Keith Case |
| Publisher | IOS Press |
| Pages | 187-197 |
| Number of pages | 11 |
| Volume | 15 |
| ISBN (Electronic) | 9781643681993 |
| ISBN (Print) | 9781643681986 |
| DOIs | |
| Publication status | Published - 10 Sept 2021 |
| Event | 18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research - Derby, United Kingdom Duration: 7 Sept 2021 → 10 Sept 2021 |
Conference
| Conference | 18th International Conference on Manufacturing Research, incorporating the 35th National Conference on Manufacturing Research |
|---|---|
| Abbreviated title | ICMR2021 |
| Country/Territory | United Kingdom |
| City | Derby |
| Period | 7/09/21 → 10/09/21 |
Bibliographical note
Funding Information:The work report ed in t his art icle is funded by t he School of Mechanical Engineering & t he Built Environment , College of Engineering & Technology, Universit y of Derby, UK.
Publisher Copyright:
© 2021 The authors and IOS Press.