Fingerprint
Dive into the research topics of 'Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling
Emeka H. Amalu, N.N. Ekere
Research output: Contribution to journal › Article › peer-review