Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

J. E Njoku; S Mallik; R. S Bhatti; Emeka Amalu; N. N Ekere

Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, N. N Ekere

SCEDT Engineering

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2015
Event	38th Internationals Spring Seminar on Electronics Technology: Novel Trend in Electronics Manufacturing - Eger, Hungary Duration: 6 May 2015 → 10 May 2015

Conference

Conference	38th Internationals Spring Seminar on Electronics Technology
Country/Territory	Hungary
City	Eger
Period	6/05/15 → 10/05/15

Cite this

@conference{f002bf9f52994f76964efdb0d3fde0c6,

title = "Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.",

author = "Njoku, {J. E} and S Mallik and Bhatti, {R. S} and Emeka Amalu and Ekere, {N. N}",

year = "2015",

language = "English",

note = "38th Internationals Spring Seminar on Electronics Technology : Novel Trend in Electronics Manufacturing ; Conference date: 06-05-2015 Through 10-05-2015",

}

TY - CONF

T1 - Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

AU - Njoku, J. E

AU - Mallik, S

AU - Bhatti, R. S

AU - Amalu, Emeka

AU - Ekere, N. N

PY - 2015

Y1 - 2015

M3 - Paper

T2 - 38th Internationals Spring Seminar on Electronics Technology

Y2 - 6 May 2015 through 10 May 2015

ER -