Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, N. N Ekere

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2015
Event38th Internationals Spring Seminar on Electronics Technology: Novel Trend in Electronics Manufacturing - Eger, Hungary
Duration: 6 May 201510 May 2015

Conference

Conference38th Internationals Spring Seminar on Electronics Technology
CountryHungary
CityEger
Period6/05/1510/05/15

Cite this

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ekere, N. N. (2015). Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.