|Publication status||Published - 2015|
|Event||38th Internationals Spring Seminar on Electronics Technology: Novel Trend in Electronics Manufacturing - Eger, Hungary|
Duration: 6 May 2015 → 10 May 2015
|Conference||38th Internationals Spring Seminar on Electronics Technology|
|Period||6/05/15 → 10/05/15|
Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ekere, N. N. (2015). Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.