Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, N. N Ekere

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Publication statusPublished - 2015
Event38th Internationals Spring Seminar on Electronics Technology: Novel Trend in Electronics Manufacturing - Eger, Hungary
Duration: 6 May 201510 May 2015

Conference

Conference38th Internationals Spring Seminar on Electronics Technology
CountryHungary
CityEger
Period6/05/1510/05/15

Cite this

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ekere, N. N. (2015). Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.
Njoku, J. E ; Mallik, S ; Bhatti, R. S ; Amalu, Emeka ; Ekere, N. N. / Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.
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title = "Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.",
author = "Njoku, {J. E} and S Mallik and Bhatti, {R. S} and Emeka Amalu and Ekere, {N. N}",
year = "2015",
language = "English",
note = "38th Internationals Spring Seminar on Electronics Technology : Novel Trend in Electronics Manufacturing ; Conference date: 06-05-2015 Through 10-05-2015",

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Njoku, JE, Mallik, S, Bhatti, RS, Amalu, E & Ekere, NN 2015, 'Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.' Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary, 6/05/15 - 10/05/15, .

Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient. / Njoku, J. E; Mallik, S; Bhatti, R. S; Amalu, Emeka; Ekere, N. N.

2015. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.

Research output: Contribution to conferencePaperResearchpeer-review

TY - CONF

T1 - Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.

AU - Njoku, J. E

AU - Mallik, S

AU - Bhatti, R. S

AU - Amalu, Emeka

AU - Ekere, N. N

PY - 2015

Y1 - 2015

M3 - Paper

ER -

Njoku JE, Mallik S, Bhatti RS, Amalu E, Ekere NN. Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.. 2015. Paper presented at 38th Internationals Spring Seminar on Electronics Technology, Eger, Hungary.