@conference{f002bf9f52994f76964efdb0d3fde0c6,
title = "Effect of component standoff height on thermo-mechanical reliability of Ball Grid Array (BGA) solder joints operating in high-temperature ambient.",
author = "Njoku, \{J. E\} and S Mallik and Bhatti, \{R. S\} and Emeka Amalu and Ekere, \{N. N\}",
year = "2015",
language = "English",
note = "38th Internationals Spring Seminar on Electronics Technology : Novel Trend in Electronics Manufacturing ; Conference date: 06-05-2015 Through 10-05-2015",
}