Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package

Keyphrases

• Solder Joint 100%
• SAC405 100%
• Creep-fatigue 100%
• BGA Package 100%
• Random Vibration 100%
• Strain Energy Density 75%
• SAC387 75%
• SAC305 75%
• Sn63Pb37 75%
• Stress-strain 50%
• Soldering 25%
• Finite Element Analysis 25%
• Strain Energy 25%
• Yield Stress 25%
• Mechanical Reliability 25%
• Lead-free 25%
• Low Stress 25%
• High Stress 25%
• Induced Failures 25%
• Electronic Devices 25%
• Lead-based 25%
• Electronic Module 25%
• Temperature Relationship 25%
• Energy Response 25%
• High Durability 25%
• Joint Display 25%
• Joint Deterioration 25%
• Failure Drivers 25%
• Stress Temperature 25%
• Sn-Ag-Cu Alloy 25%
• Stress Failure 25%
• Load Stress 25%
• Displacement Analysis 25%

Engineering

• Creep 100%
• Joints (Structural Components) 100%
• Random Vibration 100%
• Strain Energy Density 50%
• Induced Failure 33%
• Structural Reliability 16%
• Strain Energy 16%
• Induced Load 16%
• Electronic Module 16%
• Temperature Stress 16%
• Finite Element Analysis 16%
• Yield Point 16%

Material Science

• Energy Density 100%
• Solder Joint 100%
• Creep 100%
• Random Vibration 100%
• Finite Element Method 33%
• Yield Stress 33%