|Publication status||Published - 2015|
|Event||TechConnect World Innovation Conference and Expo 2015 - Washington, D.C., United States|
Duration: 14 Jun 2015 → 17 Jun 2015
|Conference||TechConnect World Innovation Conference and Expo 2015|
|Period||14/06/15 → 17/06/15|
Zarmai, M. T., Ekere, N. N., Oduoza, C. F., & Amalu, E. (2015). Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly. Paper presented at TechConnect World Innovation Conference and Expo 2015, Washington, D.C., United States.