Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly

M.T Zarmai, N. N Ekere, C. F Oduoza, Emeka Amalu

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2015
EventTechConnect World Innovation Conference and Expo 2015 - Washington, D.C., United States
Duration: 14 Jun 201517 Jun 2015


ConferenceTechConnect World Innovation Conference and Expo 2015
Country/TerritoryUnited States
CityWashington, D.C.
Internet address

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