Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly

M.T Zarmai, N. N Ekere, C. F Oduoza, Emeka Amalu

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2015
EventTechConnect World Innovation Conference and Expo 2015 - Washington, D.C., United States
Duration: 14 Jun 201517 Jun 2015
http://techconnectworld.com/World2015/

Conference

ConferenceTechConnect World Innovation Conference and Expo 2015
CountryUnited States
CityWashington, D.C.
Period14/06/1517/06/15
Internet address

Cite this

Zarmai, M. T., Ekere, N. N., Oduoza, C. F., & Amalu, E. (2015). Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly. Paper presented at TechConnect World Innovation Conference and Expo 2015, Washington, D.C., United States.