Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly

M.T Zarmai, N. N Ekere, C. F Oduoza, Emeka Amalu

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2015
Event	TechConnect World Innovation Conference and Expo 2015 - Washington, D.C., United States Duration: 14 Jun 2015 → 17 Jun 2015 http://techconnectworld.com/World2015/

Conference	TechConnect World Innovation Conference and Expo 2015
Country/Territory	United States
City	Washington, D.C.
Period	14/06/15 → 17/06/15
Internet address	http://techconnectworld.com/World2015/

Cite this

@conference{86708fbc492c4e9aac44711c1016b1ef,

title = "Effect of IMC thickness on thermo- mechanical reliability of lead-free solder joints in solar cell assembly",

author = "M.T Zarmai and Ekere, \{N. N\} and Oduoza, \{C. F\} and Emeka Amalu",

year = "2015",

language = "English",

note = "TechConnect World Innovation Conference and Expo 2015 ; Conference date: 14-06-2015 Through 17-06-2015",

url = "http://techconnectworld.com/World2015/",

}