Keyphrases
Ambient Temperature
12%
ANSYS
12%
Arrhenius
12%
Automotive Engine
12%
Ball Grid Array
100%
Ball Grid Array Package
12%
Ball Grid Array Solder Joint
12%
Creep Model
12%
Creep Response
12%
Damage Parameter
12%
Disk Drive
12%
Engine Controller
12%
High Energy Dissipation
12%
Isothermal Aging
37%
Isothermal Temperature
12%
LC Display
12%
Lead-based
12%
Lead-free
25%
Lead-free Solder
12%
Loading Conditions
12%
Low Power Dissipation
12%
Mobile Phone
12%
Printed Circuit Board
100%
SAC305
12%
SAC387
25%
SAC405
50%
Sn-Ag-Cu
12%
Sn63Pb37
25%
Solder Joint
100%
Soldering
100%
Strain Energy Density
12%
System Miniaturization
12%
System-wide
12%
Temperature Cycling
12%
Thermal Aging
12%
Thermal Cycle Loading
12%
Thermal Cycling
12%
Thermal Cycling Loading
12%
Thermomechanical Reliability
100%
Tin-silver-copper
12%
Von Mises Stress
12%
Engineering
Arrhenius
20%
Automotive Engine
20%
Ball Grid Arrays
100%
Creep
20%
Creep Model
20%
Damage Parameter
20%
Energy Dissipation
20%
Eutectics
40%
Free Solder
20%
Isothermal
60%
Joints (Structural Components)
100%
Loading Condition
20%
Mobile Phones
20%
Printed Circuit Board
100%
Strain Energy Density
20%
Structural Reliability
100%
Thermal Cycle
20%
Material Science
Creep
66%
Electronic Circuit
100%
Energy Density
33%
Lead-Free Solder
33%
Silver
33%
Solder Joint
100%
Thermal Aging
33%
Thermal Cycling
66%
Tin
33%