Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, B Ogunsemi

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2015
EventEuropean Microelectronics Packaging Conference 2015 - Friedrichshafen, Germany
Duration: 14 Sep 201516 Sep 2015

Conference

ConferenceEuropean Microelectronics Packaging Conference 2015
Abbreviated titleEMPC 2015
CountryGermany
CityFriedrichshafen
Period14/09/1516/09/15

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