Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, B Ogunsemi

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2015
EventEuropean Microelectronics Packaging Conference 2015 - Friedrichshafen, Germany
Duration: 14 Sep 201516 Sep 2015

Conference

ConferenceEuropean Microelectronics Packaging Conference 2015
Abbreviated titleEMPC 2015
CountryGermany
CityFriedrichshafen
Period14/09/1516/09/15

Cite this

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ogunsemi, B. (2015). Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.