Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

J. E Njoku, S Mallik, R. S Bhatti, Emeka Amalu, B Ogunsemi

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Publication statusPublished - 2015
EventEuropean Microelectronics Packaging Conference 2015 - Friedrichshafen, Germany
Duration: 14 Sep 201516 Sep 2015

Conference

ConferenceEuropean Microelectronics Packaging Conference 2015
Abbreviated titleEMPC 2015
CountryGermany
CityFriedrichshafen
Period14/09/1516/09/15

Cite this

Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ogunsemi, B. (2015). Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.
Njoku, J. E ; Mallik, S ; Bhatti, R. S ; Amalu, Emeka ; Ogunsemi, B. / Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.
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title = "Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component",
author = "Njoku, {J. E} and S Mallik and Bhatti, {R. S} and Emeka Amalu and B Ogunsemi",
year = "2015",
language = "English",
note = "European Microelectronics Packaging Conference 2015, EMPC 2015 ; Conference date: 14-09-2015 Through 16-09-2015",

}

Njoku, JE, Mallik, S, Bhatti, RS, Amalu, E & Ogunsemi, B 2015, 'Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component' Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany, 14/09/15 - 16/09/15, .

Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. / Njoku, J. E; Mallik, S; Bhatti, R. S; Amalu, Emeka; Ogunsemi, B.

2015. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.

Research output: Contribution to conferencePaperResearchpeer-review

TY - CONF

T1 - Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

AU - Njoku, J. E

AU - Mallik, S

AU - Bhatti, R. S

AU - Amalu, Emeka

AU - Ogunsemi, B

PY - 2015

Y1 - 2015

M3 - Paper

ER -

Njoku JE, Mallik S, Bhatti RS, Amalu E, Ogunsemi B. Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. 2015. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.