|Publication status||Published - 2015|
|Event||European Microelectronics Packaging Conference 2015 - Friedrichshafen, Germany|
Duration: 14 Sep 2015 → 16 Sep 2015
|Conference||European Microelectronics Packaging Conference 2015|
|Abbreviated title||EMPC 2015|
|Period||14/09/15 → 16/09/15|
Njoku, J. E., Mallik, S., Bhatti, R. S., Amalu, E., & Ogunsemi, B. (2015). Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component. Paper presented at European Microelectronics Packaging Conference 2015, Friedrichshafen, Germany.