Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2015
Event	European Microelectronics Packaging Conference 2015 - Friedrichshafen, Germany Duration: 14 Sept 2015 → 16 Sept 2015

Conference	European Microelectronics Packaging Conference 2015
Abbreviated title	EMPC 2015
Country/Territory	Germany
City	Friedrichshafen
Period	14/09/15 → 16/09/15

Cite this

@conference{89e30962d18245888f11989f2cb8be4a,

title = "Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component",

author = "Njoku, \{J. E\} and S Mallik and Bhatti, \{R. S\} and Emeka Amalu and B Ogunsemi",

year = "2015",

language = "English",

note = "European Microelectronics Packaging Conference 2015, EMPC 2015 ; Conference date: 14-09-2015 Through 16-09-2015",

}