Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2011
Event	3rd IEEE International Conference on Adaptive Science & Technology - Abuja, Nigeria Duration: 24 Nov 2011 → 26 Nov 2011 Conference number: 3

Conference	3rd IEEE International Conference on Adaptive Science & Technology
Country/Territory	Nigeria
City	Abuja
Period	24/11/11 → 26/11/11

Cite this

@conference{7edab39d0c3e4d9895951bb803fd801e,

title = "Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications",

author = "Amalu, {Emeka H} and Ekere, {N. N.} and G. Aminu",

year = "2011",

language = "English",

note = "3rd IEEE International Conference on Adaptive Science & Technology ; Conference date: 24-11-2011 Through 26-11-2011",

}

TY - CONF

T1 - Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

AU - Amalu, Emeka H

AU - Ekere, N. N.

AU - Aminu, G.

N1 - Conference code: 3

PY - 2011

Y1 - 2011

M3 - Paper

T2 - 3rd IEEE International Conference on Adaptive Science & Technology

Y2 - 24 November 2011 through 26 November 2011

ER -