Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Publication statusPublished - 2011
Event3rd IEEE International Conference on Adaptive Science & Technology - Abuja, Nigeria
Duration: 24 Nov 201126 Nov 2011
Conference number: 3

Conference

Conference3rd IEEE International Conference on Adaptive Science & Technology
CountryNigeria
CityAbuja
Period24/11/1126/11/11

Cite this

Amalu, E. H., Ekere, N. N., & Aminu, G. (2011). Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria.
Amalu, Emeka H ; Ekere, N. N. ; Aminu, G. / Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria.
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title = "Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications",
author = "Amalu, {Emeka H} and Ekere, {N. N.} and G. Aminu",
year = "2011",
language = "English",
note = "3rd IEEE International Conference on Adaptive Science & Technology ; Conference date: 24-11-2011 Through 26-11-2011",

}

Amalu, EH, Ekere, NN & Aminu, G 2011, 'Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications' Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria, 24/11/11 - 26/11/11, .

Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. / Amalu, Emeka H; Ekere, N. N.; Aminu, G.

2011. Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria.

Research output: Contribution to conferencePaperResearchpeer-review

TY - CONF

T1 - Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

AU - Amalu, Emeka H

AU - Ekere, N. N.

AU - Aminu, G.

PY - 2011

Y1 - 2011

M3 - Paper

ER -

Amalu EH, Ekere NN, Aminu G. Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. 2011. Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria.