Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2011
Event3rd IEEE International Conference on Adaptive Science & Technology - Abuja, Nigeria
Duration: 24 Nov 201126 Nov 2011
Conference number: 3

Conference

Conference3rd IEEE International Conference on Adaptive Science & Technology
CountryNigeria
CityAbuja
Period24/11/1126/11/11

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