Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2011
Event3rd IEEE International Conference on Adaptive Science & Technology - Abuja, Nigeria
Duration: 24 Nov 201126 Nov 2011
Conference number: 3

Conference

Conference3rd IEEE International Conference on Adaptive Science & Technology
CountryNigeria
CityAbuja
Period24/11/1126/11/11

Cite this

Amalu, E. H., Ekere, N. N., & Aminu, G. (2011). Effects of intermetallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. Paper presented at 3rd IEEE International Conference on Adaptive Science & Technology, Abuja, Nigeria.