Electrical Apparatus Encapsulant

Graham Bruce, John Cullen, Stephen Husband, Yongxin Pang, S.N.B. Hodgson

Research output: Other contributionResearch

Abstract

An encapsulant composition comprises a silica containing inorganic-organic nano-hybrid matrix, particles of refractory ceramics suspended in the inorganic-organic nano-hybrid matrix, and, optionally, glass or ceramic fibres. The encapsulant may also contain ceramic coated metallic particles, and in some embodiments. a solvent or binder. The formulations can include a solvent. which may be removed during
a curing process, or may be solvent-less.
Original languageEnglish
TypeUS Patent 2018/0037771A1
Number of pages14
Publication statusPublished - 8 Feb 2018

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ceramic fibers
ceramics
refractories
glass fibers
matrices
curing
silicon dioxide
formulations
fibers

Cite this

Bruce, G., Cullen, J., Husband, S., Pang, Y., & Hodgson, S. N. B. (2018, Feb 8). Electrical Apparatus Encapsulant.
Bruce, Graham ; Cullen, John ; Husband, Stephen ; Pang, Yongxin ; Hodgson, S.N.B. / Electrical Apparatus Encapsulant. 2018. 14 p.
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author = "Graham Bruce and John Cullen and Stephen Husband and Yongxin Pang and S.N.B. Hodgson",
year = "2018",
month = "2",
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Bruce, G, Cullen, J, Husband, S, Pang, Y & Hodgson, SNB 2018, Electrical Apparatus Encapsulant..

Electrical Apparatus Encapsulant. / Bruce, Graham; Cullen, John ; Husband, Stephen; Pang, Yongxin; Hodgson, S.N.B.

14 p. 2018, US Patent 2018/0037771A1.

Research output: Other contributionResearch

TY - GEN

T1 - Electrical Apparatus Encapsulant

AU - Bruce, Graham

AU - Cullen, John

AU - Husband, Stephen

AU - Pang, Yongxin

AU - Hodgson, S.N.B.

PY - 2018/2/8

Y1 - 2018/2/8

N2 - An encapsulant composition comprises a silica containing inorganic-organic nano-hybrid matrix, particles of refractory ceramics suspended in the inorganic-organic nano-hybrid matrix, and, optionally, glass or ceramic fibres. The encapsulant may also contain ceramic coated metallic particles, and in some embodiments. a solvent or binder. The formulations can include a solvent. which may be removed duringa curing process, or may be solvent-less.

AB - An encapsulant composition comprises a silica containing inorganic-organic nano-hybrid matrix, particles of refractory ceramics suspended in the inorganic-organic nano-hybrid matrix, and, optionally, glass or ceramic fibres. The encapsulant may also contain ceramic coated metallic particles, and in some embodiments. a solvent or binder. The formulations can include a solvent. which may be removed duringa curing process, or may be solvent-less.

M3 - Other contribution

ER -

Bruce G, Cullen J, Husband S, Pang Y, Hodgson SNB. Electrical Apparatus Encapsulant. 2018. 14 p.