Evaluation of Garofalo Creep Model for Lead-free Solder Joints in Surface Mount Components

Emeka Amalu, N. N Ekere, C. F Oduoza, M.T Zarmai

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2015
EventTechConnect World Innovation Conference and Expo 2015 - Washington, D.C., United States
Duration: 14 Jun 201517 Jun 2015
http://techconnectworld.com/World2015/

Conference

ConferenceTechConnect World Innovation Conference and Expo 2015
CountryUnited States
CityWashington, D.C.
Period14/06/1517/06/15
Internet address

Cite this

Amalu, E., Ekere, N. N., Oduoza, C. F., & Zarmai, M. T. (2015). Evaluation of Garofalo Creep Model for Lead-free Solder Joints in Surface Mount Components. Paper presented at TechConnect World Innovation Conference and Expo 2015, Washington, D.C., United States.