| Original language | English |
|---|---|
| Number of pages | 0 |
| Publication status | Published - 2014 |
Flip chip assembly: Modelling the joints’ high-temperature reliability
Research output: Book/Report › Book
Research output: Book/Report › Book
| Original language | English |
|---|---|
| Number of pages | 0 |
| Publication status | Published - 2014 |