High Temperature Electronics: R&D Challenges and Trends in Materials, Packaging and Interconnection Technology

Emeka H Amalu, N. N. Ekere, R. S. Bhatti

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2009
Event2nd International Conference on Adaptive Science & Technology - Accra, Ghana
Duration: 14 Dec 200916 Dec 2009
Conference number: 2

Conference

Conference2nd International Conference on Adaptive Science & Technology
CountryGhana
CityAccra
Period14/12/0916/12/09

Cite this

Amalu, E. H., Ekere, N. N., & Bhatti, R. S. (2009). High Temperature Electronics: R&D Challenges and Trends in Materials, Packaging and Interconnection Technology. Paper presented at 2nd International Conference on Adaptive Science & Technology, Accra, Ghana.