High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology

E. H. Amalu, N. N. Ekere, R. S. Bhatti

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Citations (Scopus)

Fingerprint

Dive into the research topics of 'High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology'. Together they form a unique fingerprint.

Keyphrases

Engineering