Keyphrases
Lead-free Solder Joints
100%
Flip chip
100%
Fatigue Life
100%
Standoff
100%
High Temperature Fatigue
100%
Solder Joint
66%
Damage Accumulation
66%
Static Structural
66%
Flip-chip Assembly
66%
Bond Pad
66%
Printed Circuit Board
33%
Soldering
33%
Finite Element Modeling
33%
Structural Integrity
33%
Thermo
33%
Intermetallic Compounds
33%
Solder Joint Damage
33%
High Temperature
33%
Thermal Load
33%
High Ambient Temperature
33%
Work Density
33%
Plastic Work
33%
Viscoplastic Material
33%
Plastic Strain
33%
Sensor Device
33%
Stress-strain
33%
Damage Indicator
33%
Joint Assembly
33%
Cubic Function
33%
Control Device
33%
Plastic Degradation
33%
Microelectronics
33%
Fatigue Failure
33%
Temperature Excursion
33%
Solder Mask
33%
Engineering
Joints (Structural Components)
100%
Fatigue Life
100%
Free Solder
100%
High-Temperature Fatigue
100%
Led Chip
100%
Printed Circuit Board
12%
Structural Integrity
12%
Modeling Study
12%
Plastic Work
12%
Plastic Strain
12%
Damage Indicator
12%
Fatigue Failure
12%
Microelectronics
12%
Thermal Load
12%
Fem Model
12%
Intermetallics
12%