High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

Keyphrases

• Lead-free Solder Joints 100%
• Flip chip 100%
• Standoff 100%
• High Temperature Fatigue Life 100%
• Solder Joint 66%
• Fatigue Life 66%
• Damage Accumulation 66%
• Static Structural 66%
• Flip-chip Assembly 66%
• Bonding Pad 66%
• Printed Circuit Board 33%
• Soldering 33%
• Finite Element Modeling 33%
• Structural Integrity 33%
• Intermetallic Compounds 33%
• Solder Joint Damage 33%
• High Temperature 33%
• Thermal Load 33%
• Work Density 33%
• Plastic Work 33%
• Plastic Strain 33%
• Stress-strain 33%
• Damage Indicator 33%
• Joint Assembly 33%
• Cubic Function 33%
• Control Device 33%
• Plastic Degradation 33%
• Microelectronics 33%
• Fatigue Failure 33%
• Temperature Excursion 33%
• Solder Mask 33%
• Visco-plastic 33%
• High Temperature Ambient 33%
• Sensor Devices 33%

Engineering

• Joints (Structural Components) 100%
• Fatigue Life 100%
• Free Solder 100%
• High-Temperature Fatigue 100%
• Led Chip 100%
• Printed Circuit Board 12%
• Structural Integrity 12%
• Modeling Study 12%
• Plastic Work 12%
• Plastic Strain 12%
• Damage Indicator 12%
• Fatigue Failure 12%
• Microelectronics 12%
• Thermal Load 12%
• Fem Model 12%
• Intermetallics 12%

Material Science

• Fatigue of Materials 100%
• Solder Joint 100%
• Lead-Free Solder 100%
• Thermal Fatigue 100%
• Density 20%
• Finite Element Modeling 20%
• Electronic Circuit 20%
• Thermal Load 20%
• Control Component 20%
• Intermetallics 20%