Keyphrases
Lead-free Solder Joints
100%
Intermetallic Compounds
100%
Flip-chip Assembly
100%
High-temperature Reliability
100%
Solder Joint
60%
Printed Circuit Board
40%
Soldering
40%
Bump
40%
Bond Pad
40%
Analytical Method
20%
Flip chip
20%
IEC Standards
20%
Finite Element Modeling
20%
Sn-Ag-Cu Solder
20%
Solder Bump
20%
Most Vulnerable
20%
Solder Joint Reliability
20%
Fatigue Failure
20%
Solder Pads
20%
Joint Model
20%
Sn-based Solder
20%
Anand Model
20%
Solder Joint Fatigue Life
20%
Viscoplastic Behavior
20%
Copper Substrate
20%
Analytical Constructions
20%
Engineering
Joints (Structural Components)
100%
Free Solder
100%
Intermetallics
83%
Printed Circuit Board
33%
Interconnects
33%
Fatigue Life
16%
Experimental Investigation
16%
Solder Bump
16%
Fatigue Failure
16%
Copper Substrate
16%
Fem Model
16%
Material Science
Solder Joint
100%
Lead-Free Solder
100%
Intermetallics
83%
Electronic Circuit
33%
Fatigue of Materials
16%
Finite Element Modeling
16%
Analytical Method
16%
Viscoplastic Behavior
16%