Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint Integrity

Emeka H Amalu, N. N. Ekere, R. S. Bhatti, G. Takyi

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2010
EventInternational Conference on Advances in Materials and Processing Technologies - Paris, France
Duration: 24 Oct 201027 Oct 2010

Conference

ConferenceInternational Conference on Advances in Materials and Processing Technologies
Abbreviated title AMPT 2010
CountryFrance
CityParis
Period24/10/1027/10/10

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