Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint Integrity

Emeka H Amalu, N. N. Ekere, R. S. Bhatti, G. Takyi

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2010
Event	International Conference on Advances in Materials and Processing Technologies - Paris, France Duration: 24 Oct 2010 → 27 Oct 2010

Conference	International Conference on Advances in Materials and Processing Technologies
Abbreviated title	AMPT 2010
Country/Territory	France
City	Paris
Period	24/10/10 → 27/10/10

Cite this

@conference{5edfdf0ef65c4113ad34b50365d8ac56,

title = "Investigation of Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes and Joint Integrity",

author = "Amalu, {Emeka H} and Ekere, {N. N.} and Bhatti, {R. S.} and G. Takyi",

year = "2010",

language = "English",

note = "International Conference on Advances in Materials and Processing Technologies, AMPT 2010 ; Conference date: 24-10-2010 Through 27-10-2010",

}