Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

E. H. Amalu, N. N. Ekere, R. S. Bhatti, G. Takyi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Original languageEnglish
Title of host publicationInternational Conference on Advances in Materials and Processing Technologies, AMPT2010
Pages639-644
Number of pages6
Volume1315
DOIs
Publication statusPublished - 1 Dec 2010
EventInternational Conference on Advances in Materials and Processing Technologies - Paris, France
Duration: 24 Oct 201027 Oct 2010

Conference

ConferenceInternational Conference on Advances in Materials and Processing Technologies
Abbreviated title AMPT 2010
CountryFrance
CityParis
Period24/10/1027/10/10

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