Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2011
EventAES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications - Montreal, Canada
Duration: 1 Aug 20115 Aug 2011

Conference

ConferenceAES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications
CountryCanada
CityMontreal
Period1/08/115/08/11

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