Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter

Emeka H Amalu, N. N. Ekere, G. Aminu

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2011
EventAES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications - Montreal, Canada
Duration: 1 Aug 20115 Aug 2011

Conference

ConferenceAES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications
CountryCanada
CityMontreal
Period1/08/115/08/11

Cite this

Amalu, E. H., Ekere, N. N., & Aminu, G. (2011). Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter. Paper presented at AES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications, Montreal, Canada.