Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter

Emeka H Amalu; N. N. Ekere; G. Aminu

Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter

Emeka H Amalu, N. N. Ekere, G. Aminu

SCEDT Engineering

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2011
Event	AES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications - Montreal, Canada Duration: 1 Aug 2011 → 5 Aug 2011

Conference

Conference	AES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications
Country/Territory	Canada
City	Montreal
Period	1/08/11 → 5/08/11

Cite this

@conference{72014d25bb5f47249f64485f9e0dc49e,

title = "Modeling High Temperature Reliability of Flip Chip Pb- free Solder Joint at varying Bond Pad Diameter",

author = "Amalu, \{Emeka H\} and Ekere, \{N. N.\} and G. Aminu",

year = "2011",

language = "English",

note = "AES- ATEMA 2011 International Conference on Advances and Trends in Engineering Materials and their Applications ; Conference date: 01-08-2011 Through 05-08-2011",

}