Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application

Emeka H Amalu, N. N. Ekere, R. S. Bhatti, G. Takyi, A. O. A. Ibhadode

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2010
Event3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology
- Benin City, Nigeria
Duration: 7 Sep 20109 Sep 2010
Conference number: 3

Conference

Conference3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology
Country/TerritoryNigeria
CityBenin City
Period7/09/109/09/10

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