Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application

Emeka H Amalu, N. N. Ekere, R. S. Bhatti, G. Takyi, A. O. A. Ibhadode

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2010
Event3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology
- Benin City, Nigeria
Duration: 7 Sep 20109 Sep 2010
Conference number: 3

Conference

Conference3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology
CountryNigeria
CityBenin City
Period7/09/109/09/10

Cite this

Amalu, E. H., Ekere, N. N., Bhatti, R. S., Takyi, G., & Ibhadode, A. O. A. (2010). Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Application. Paper presented at 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology
, Benin City, Nigeria.