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Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion

  • E. H. Amalu
  • , N. N. Ekere
  • , R. S. Bhatti
  • , S. Mallik
  • , G. Takyi
  • , A. O.A. Ibhadode

Research output: Contribution to journal › Article › peer-review

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