Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate

Osarumen Ogbomo; Emeka Amalu; N. N Ekere

Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate

Osarumen Ogbomo, Emeka Amalu, N. N Ekere

SCEDT Engineering

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2016
Event	26th International Conference on Flexible Automation and Intelligent Manufacturing - Seoul, Korea, Republic of Duration: 27 Jun 2016 → 30 Jun 2016

Conference

Conference	26th International Conference on Flexible Automation and Intelligent Manufacturing
Abbreviated title	FAIM 2016
Country/Territory	Korea, Republic of
City	Seoul
Period	27/06/16 → 30/06/16

Cite this

@conference{88d24ce581a04a91bec6875a3ca16388,

title = "Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate",

author = "Osarumen Ogbomo and Emeka Amalu and Ekere, {N. N}",

year = "2016",

language = "English",

note = "26th International Conference on Flexible Automation and Intelligent Manufacturing, FAIM 2016 ; Conference date: 27-06-2016 Through 30-06-2016",

}

Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate. / Ogbomo, Osarumen; Amalu, Emeka; Ekere, N. N.
2016. Paper presented at 26th International Conference on Flexible Automation and Intelligent Manufacturing, Seoul, Korea, Republic of.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Numerical study on effect of high-temperature on degradation of solder joints in photovoltaic module for improved reliability in hot climate

AU - Ogbomo, Osarumen

AU - Amalu, Emeka

AU - Ekere, N. N

PY - 2016

Y1 - 2016

M3 - Paper

T2 - 26th International Conference on Flexible Automation and Intelligent Manufacturing

Y2 - 27 June 2016 through 30 June 2016

ER -