Fingerprint
Dive into the research topics of 'Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device
R. S. Bhatti, N. N. Ekere, S. Mallik, E. H. Amalu
Research output: Contribution to journal › Article › peer-review
24
Citations
(Scopus)