Fingerprint
Dive into the research topics of 'Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations
Emeka H. Amalu, Ndy N. Ekere
Research output: Contribution to journal › Article › peer-review