Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules

Cuili Chen, Volker Pickert, Maher Al-Greer, Charalampos Tsimenidis, Thillainathan Logenthiran, Xiang Lu Chong, Chong Ng, Chunjiang Jai

Research output: Contribution to conference › Paper › peer-review

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Engineering

Material Science