Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules
- Cuili Chen
- , Volker Pickert
- , Maher Al-Greer
- , Charalampos Tsimenidis
- , Thillainathan Logenthiran
- , Xiang Lu Chong
- , Chong Ng
- , Chunjiang Jai
Research output: Contribution to conference › Paper › peer-review