Study of the effect of Inter-Metallic Compound thickness on Damage and Fatigue Life of Lead-free Flip Chip Solder Joints at High Temperature Excursions

Emeka H Amalu, N. N. Ekere

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2012
EventInternational Welding/Joining Conference 2012 - , Korea, Republic of
Duration: 1 Jan 20121 Jan 2012

Conference

ConferenceInternational Welding/Joining Conference 2012
CountryKorea, Republic of
Period1/01/121/01/12

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