Study of the effect of Inter-Metallic Compound thickness on Damage and Fatigue Life of Lead-free Flip Chip Solder Joints at High Temperature Excursions

Emeka H Amalu; N. N. Ekere

Study of the effect of Inter-Metallic Compound thickness on Damage and Fatigue Life of Lead-free Flip Chip Solder Joints at High Temperature Excursions

SCEDT Engineering

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2012
Event	International Welding/Joining Conference 2012 - , Korea, Republic of Duration: 1 Jan 2012 → 1 Jan 2012

Conference

Conference	International Welding/Joining Conference 2012
Country/Territory	Korea, Republic of
Period	1/01/12 → 1/01/12

Cite this

@conference{59bc22313ab643e2b06e2bd71577965f,

title = "Study of the effect of Inter-Metallic Compound thickness on Damage and Fatigue Life of Lead-free Flip Chip Solder Joints at High Temperature Excursions",

author = "Amalu, \{Emeka H\} and Ekere, \{N. N.\}",

year = "2012",

language = "English",

note = "International Welding/Joining Conference 2012 ; Conference date: 01-01-2012 Through 01-01-2012",

}