Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

Emeka Amalu, N. N Ekere, M.T Zarmai

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - 2014
Event1st International Symposium on Industrial Design Engineering - Karabuk, Turkey
Duration: 8 May 20149 May 2014

Conference

Conference1st International Symposium on Industrial Design Engineering
Abbreviated titleISIDE 14
CountryTurkey
CityKarabuk
Period8/05/149/05/14

Cite this

Amalu, E., Ekere, N. N., & Zarmai, M. T. (2014). Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey.