Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

Emeka Amalu, N. N Ekere, M.T Zarmai

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
Publication statusPublished - 2014
Event1st International Symposium on Industrial Design Engineering - Karabuk, Turkey
Duration: 8 May 20149 May 2014

Conference

Conference1st International Symposium on Industrial Design Engineering
Abbreviated titleISIDE 14
CountryTurkey
CityKarabuk
Period8/05/149/05/14

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