Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

Emeka Amalu, N. N Ekere, M.T Zarmai

Research output: Contribution to conference › Paper › peer-review

Original language	English
Publication status	Published - 2014
Event	1st International Symposium on Industrial Design Engineering - Karabuk, Turkey Duration: 8 May 2014 → 9 May 2014

Conference	1st International Symposium on Industrial Design Engineering
Abbreviated title	ISIDE 14
Country/Territory	Turkey
City	Karabuk
Period	8/05/14 → 9/05/14

Cite this

@conference{c877b294104e41319fc89936451ff099,

title = "Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications",

author = "Emeka Amalu and Ekere, {N. N} and M.T Zarmai",

year = "2014",

language = "English",

note = "1st International Symposium on Industrial Design Engineering, ISIDE 14 ; Conference date: 08-05-2014 Through 09-05-2014",

}