Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

Emeka Amalu, N. N Ekere, M.T Zarmai

Research output: Contribution to conferencePaperResearchpeer-review

Original languageEnglish
Publication statusPublished - 2014
Event1st International Symposium on Industrial Design Engineering - Karabuk, Turkey
Duration: 8 May 20149 May 2014

Conference

Conference1st International Symposium on Industrial Design Engineering
Abbreviated titleISIDE 14
CountryTurkey
CityKarabuk
Period8/05/149/05/14

Cite this

Amalu, E., Ekere, N. N., & Zarmai, M. T. (2014). Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey.
Amalu, Emeka ; Ekere, N. N ; Zarmai, M.T. / Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey.
@conference{c877b294104e41319fc89936451ff099,
title = "Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications",
author = "Emeka Amalu and Ekere, {N. N} and M.T Zarmai",
year = "2014",
language = "English",
note = "1st International Symposium on Industrial Design Engineering, ISIDE 14 ; Conference date: 08-05-2014 Through 09-05-2014",

}

Amalu, E, Ekere, NN & Zarmai, MT 2014, 'Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications' Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey, 8/05/14 - 9/05/14, .

Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. / Amalu, Emeka; Ekere, N. N; Zarmai, M.T.

2014. Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey.

Research output: Contribution to conferencePaperResearchpeer-review

TY - CONF

T1 - Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications

AU - Amalu, Emeka

AU - Ekere, N. N

AU - Zarmai, M.T

PY - 2014

Y1 - 2014

M3 - Paper

ER -

Amalu E, Ekere NN, Zarmai MT. Thermo-mechanical reliability of lead-free solder joints in flip chip package for high-temperature applications. 2014. Paper presented at 1st International Symposium on Industrial Design Engineering, Karabuk, Turkey.