Wearable pressure sensing for lower limb amputees

Zhonghai Lu, Wenyao Zhu, Yizhi Chen, Josephine Charnley, Valter Dejke, Andrii Pomazanskyi, Siu-teing Ko, Begum Zeybek, Pouyan Mehryar, Zulfiqur Ali, Michalis Karamousadakis, Dejiu Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Pressure sensing in prosthetic sockets is valuable as it provides quantified data to assist prosthetists in designing comfortable sockets for amputees. We present a wearable pressure sensing system for lower limb amputees. The full system consists of three essential elements from sensing scheme (wearable sensors, sensor calibration and deployment), electronic measurement system (embedded hardware and software), to time-series database and visualization. The full system has been successfully applied in clinical trials to effectively collect pressure data in real-time.
Original languageEnglish
Title of host publicationIEEE Biomedical Circuits and Systems Conference
Subtitle of host publicationIntelligent Biomedical Systems for a Better Future, Proceedings
PublisherIEEE
Pages105-109
Number of pages5
Volume2022
ISBN (Electronic)9781665469173
ISBN (Print)9781665469173
DOIs
Publication statusPublished - 16 Nov 2022
Event2022 IEEE Biomedical Circuits and Systems Conference (BioCAS) - Taipei, Taiwan
Duration: 13 Oct 202215 Oct 2022

Publication series

NameBioCAS 2022 - IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Systems for a Better Future, Proceedings

Conference

Conference2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)
Period13/10/2215/10/22

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This research was completed as part of the SocketSense project that has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 825429.

Funding Information:
This research was completed as part of the SocketSense project that has received funding from the European Union s Horizon 2020 research and innovation programme under grant agreement No 825429

Publisher Copyright:
© 2022 IEEE.

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